Graphite Thermal Pads

Graphite Thermal Pads are thermal interface material engineered for applications demanding high reliability, minimal contact resistance, extended service life, and low maintenance.

HPMS Thermal Pads have high compressibility which reduces thermal resistance by conforming to gaps, warpage and distortion of target substrates. Has excellent heat resistance, reliability, and thermal conductivity in both in-plane and through-plane directions. It is an ideal heat spreader for thermal management in limited space.

Graphite Thermal Pads are excellent thermal interface materials

Its flexible graphite composition is precisely die-cut to ensure a perfect fit and minimize variation between modules during assembly. With its inherent compressibility, the material enhances surface conformity, lowers thermal impedance, and compensates for flatness deviations up to 125μ, while its superior in-plane conductivity effectively dissipates hot spots.

Advantages of HPMS Graphite Thermal Pads

High thermal conductivity: X-Y direction: 500 W/m.K; Z direction: 28 W/m.K
Low thermal impedance: 0.2 K.cm2/W (600 kPa)
Compressibility: 55% or more
Long term reliability: -40 to 400 oC
Excellent adsorption of low concentration substances.
Simple installation, low maintenance, and long service life.
RoHS Compliant

Applications

Cooling of heat-generating components such as IGBT power modules inside electronic devices
In-vehicle cameras, motor control units, automotive LEDs, HUD laser light sources, medical devices.
Semiconductor manufacturing equipment (sputtering, etching, lithography, laser machines).
Various inverters and converters
High performance computers and servers
Base stations / telecommunication
EV / HEV / PHEV modules

Typical Properties of HPMS Graphite Thermal Pads

Property	Unit	HGC-200	HGC-300	HGC-400	HGC-500	HGC-700
Thickness	mm	0.2	0.3	0.4	0.5	0.7
Thermal Impedance @ 200 kPa (29 psi)	K-cm2/W	0.40
Thermal Impedance @ 700 kPa (101 psi)	K-cm2/W	0.18
Typical Thermal Conductivity, In-Plane	W/m-K	500
Typical Thermal Conductivity, Through-Plane	W/m-K	28
Coefficient of Thermal Expansion, In-Plane	ppm/°C	-0.4
Coefficient of Thermal Expansion, Through-Plane	ppm/°C	27
Electrical Conductivity, In-Plane	S/cm	19,000
Compressibility @ 600 kPa	%	>55
Heat Resistance	°C	400
Operating Temperature	°C	-40 to +400
Specific Heat @25°C	J/g-°C	0.85
RoHS compliant	Y/N	Yes

Electronics Thermal Management

Industrial Sealing

Air / Water Treatment

Furnance Insulation

Natural Graphite

Graphite Thermal Pads