Graphite Thermal Pads
Graphite Thermal Pads are thermal interface material engineered for applications demanding high reliability, minimal contact resistance, extended service life, and low maintenance.
HPMS Thermal Pads have high compressibility which reduces thermal resistance by conforming to gaps, warpage and distortion of target substrates. Has excellent heat resistance, reliability, and thermal conductivity in both in-plane and through-plane directions. It is an ideal heat spreader for thermal management in limited space.
Its flexible graphite composition is precisely die-cut to ensure a perfect fit and minimize variation between modules during assembly. With its inherent compressibility, the material enhances surface conformity, lowers thermal impedance, and compensates for flatness deviations up to 125μ, while its superior in-plane conductivity effectively dissipates hot spots.
- High thermal conductivity: X-Y direction: 500 W/m.K; Z direction: 28 W/m.K
- Low thermal impedance: 0.2 K.cm2/W (600 kPa)
- Compressibility: 55% or more
- Long term reliability: -40 to 400 oC
- Excellent adsorption of low concentration substances.
- Simple installation, low maintenance, and long service life.
- RoHS Compliant
- Cooling of heat-generating components such as IGBT power modules inside electronic devices
- In-vehicle cameras, motor control units, automotive LEDs, HUD laser light sources, medical devices.
- Semiconductor manufacturing equipment (sputtering, etching, lithography, laser machines).
- Various inverters and converters
- High performance computers and servers
- Base stations / telecommunication
- EV / HEV / PHEV modules
| Property | Unit | HGC-200 | HGC-300 | HGC-400 | HGC-500 | HGC-700 |
|---|---|---|---|---|---|---|
| Thickness | mm | 0.2 | 0.3 | 0.4 | 0.5 | 0.7 |
| Thermal Impedance @ 200 kPa (29 psi) | K-cm2/W | 0.40 | ||||
| Thermal Impedance @ 700 kPa (101 psi) | K-cm2/W | 0.18 | ||||
| Typical Thermal Conductivity, In-Plane | W/m-K | 500 | ||||
| Typical Thermal Conductivity, Through-Plane | W/m-K | 28 | ||||
| Coefficient of Thermal Expansion, In-Plane | ppm/°C | -0.4 | ||||
| Coefficient of Thermal Expansion, Through-Plane | ppm/°C | 27 | ||||
| Electrical Conductivity, In-Plane | S/cm | 19,000 | ||||
| Compressibility @ 600 kPa | % | >55 | ||||
| Heat Resistance | °C | 400 | ||||
| Operating Temperature | °C | -40 to +400 | ||||
| Specific Heat @25°C | J/g-°C | 0.85 | ||||
| RoHS compliant | Y/N | Yes | ||||